METHOD FOR BONDING METAL MEMBER AND RESIN MEMBER

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United States of America Patent

SERIAL NO

14000453

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Abstract

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A metal member 1 and a resin member 2 are brought into contact with each other without interposing a resin layer between the metal member 1 and the resin member 2. A rotation tool 10, which is being rotated, is pressed against the surface 1a of the metal member 1 in an inclined state so that the inclination angle θ of the axis Q of the rotation tool 10 relative to the normal line P of the surface 1a of the metal member 1 satisfies the condition of 0°<θ≦5°. This applies friction energy to the metal member 1 to join the metal member 1 and the resin member 2.

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Patent Owner(s)

Patent OwnerAddress
SHOWA DENKO K KTOKYO JAPAN
OSAKA UNIVERSITYSUITA-SHI OSAKA 565-0871
FURUKAWA-SKY ALUMINUM CORPJAPAN TOKYO CHIYODA DISTRICT KANDA 4 CHOME 14 NO 1 TOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nagano, Yoshitaka Oyama-shi, JP 43 644
Nakata, Kazuhiro Suita-shi, JP 29 272
Okada, Toshiya Chiyoda-ku, JP 25 242

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