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Abstract

Provided is a method of manufacturing a mold for nano-imprint, for forming a projection/recess pattern on a surface of a silicon substrate, including: etching a substrate to form the projection/recess pattern on the surface of the silicon substrate by applying dry-etching to the silicon substrate using a hard mask pattern as a mask, in a state of covering the surface of the silicon substrate with the hard mask pattern made of a chromium-based material; and applying dry-etching to the silicon substrate in etching the substrate using a fluorine-based gas as a reactive gas of an etching gas used for the dry-etching applied to the silicon substrate, and adding an inert gas to the etching gas.

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First Claim