LEAD-FREE GLASS FOR SEMICONDUCTOR ENCAPSULATION AND ENCAPSULATOR FOR SEMICONDUCTOR ENCAPSULATION
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 6, 2014
app pub date -
Nov 4, 2011
filing date -
Nov 11, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention provides a lead-free glass for semiconductor encapsulation, which can encapsulate semiconductor devices at a low temperature and has an excellent acid durability, and an encapsulator for semiconductor encapsulation made of the glass. The glass comprises, as a glass composition, from 46 to 60% of SiO2, from 0 to 6% of Al2O3, from 13 to 30% of B2O3, from 0 to 10% of MgO, from 0 to 10% of CaO, from 0 to 20% of ZnO, from 9 to 25% of Li2O, from 0 to 15% of Na2O, from 0 to 7% of K2O, and from 0 to 8% of TiO2, in terms of % by mol, wherein a ratio by mol of Li2O to (Li2O+Na2O+K2O) is in the range from 0.48 to 1.00.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully