RESIN MOLDED PRODUCT AND METHOD FOR PRODUCING SAME
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United States of America Patent
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Issued Date -
Mar 13, 2014
app pub date -
Mar 13, 2012
filing date -
Mar 17, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A resin molded product for reducing the external force applied to a first element from each electroconductive member due to a pressure of a resin at the time of molding, when each of the electroconductive members and the first element are insert-molded with the resin, and a method for producing the same. A second element fixing the electroconductive members to each other is connected to each of the electroconductive members so as to lie astride each of the electroconductive members. Accordingly, even though a pressure of the resin which flows into a die has been applied to each of the electroconductive members when a resin part that covers each of the electroconductive members and the first element is formed by insert molding, the distortion occurring among each of the electroconductive members is reduced by the second element.
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