Tunable composite interposer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Feb 24, 2015
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N/A
app pub date -
Sep 13, 2012
filing date -
Sep 13, 2012
priority date (Note) -
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Abstract
A composite interposer can include a substrate element and a support element. The substrate element can have first and second opposite surfaces defining a thickness of 200 microns or less, and can have a plurality of contacts exposed at the first surface and electrically conductive structure extending through the thickness. The support element can have a body of at least one of dielectric or semiconductor material exposed at a second surface of the support element, openings extending through a thickness of the body, conductive vias extending within at least some of the openings in a direction of the thickness of the body, and terminals exposed at a first surface of the support element. The second surface of the support element can be united with the second surface of the substrate element. The terminals can be electrically connected with the contacts through the conductive vias and the electrically conductive structure.
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