Direct Electroless Palladium Plating on Copper
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 13, 2014
app pub date -
Sep 11, 2012
filing date -
Sep 11, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of providing a direct electroless palladium deposit on a copper surface is described. The method comprises the steps of (a) catalyzing the copper surface by applying a pre-dip composition to the copper surface, the pre-dip composition comprising a reducing agent; and thereafter (b) contacting the catalyzed copper surface with an electroless palladium composition to deposit a layer of palladium on the copper surface.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully