METHOD FOR MANUFACTURING LED LEAD FRAME

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United States of America Patent

APP PUB NO 20140075751A1
SERIAL NO

13732728

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention relates to a method for manufacturing LED lead frame. The method comprises steps of: (a) forming a metal base with a plurality of lead areas by injection molding; (b) electroplating the metal base; and (c) forming an insulating casing on each of the lead areas.

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Patent Owner(s)

Patent OwnerAddress
I-CHIUN PRECISION INDUSTRY CO LTDNO 17 WUGUNG 5TH RD SINJHUANG CITY TAIPEI COUNTY 24890

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LI, Ting-Hsi New Taipei City, TW 2 1
LIN, Yu-Jen New Taipei City, TW 67 241

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