PRINTING STENCILS FOR APPLYING A PRINTING PATTERN TO A SUBSTRATE AND METHOD FOR PRODUCING A PRINTING STENCIL
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United States of America Patent
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app pub date -
Jan 27, 2012
filing date -
Jan 27, 2011
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a printing stencil, for example, for applying a contacting (contact finger, busbar(s)) to a substrate of a solar cell and to a method for producing such a printing stencil. The printing stencil can include a carrier layer and a structure layer located below the carrier layer, the structure layer having at least one printed image opening which corresponds to at least a portion of the printed image of the contacting (contact finger, busbar(s)), the carrier layer having one or more carrier layer openings and the one or more carrier layer openings overlapping when the printing stencil is viewed from above, with respect to the printed image opening in such a manner that the printing stencil has an opening which is formed from the at least one printed image opening and the one or more carrier layer openings, and is suitable for applying contacting material to the substrate through the opening.
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