LIGHT EMITTING DEVICE BONDED TO A SUPPORT SUBSTRATE
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United States of America Patent
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Issued Date -
Mar 20, 2014
app pub date -
May 22, 2012
filing date -
Jun 1, 2011
priority date (Note) -
Abandoned
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Abstract
A support substrate including a body (35) and a plurality of vias (48) extending through an entire thickness of the body is bonded to a semiconductor light emitting device including a light emitting layer (14) sandwiched between an n-type region (12) and a p-type region (16). The support substrate is no wider than the semiconductor light emitting device.
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