Semiconductor device and method for manufacturing thereof

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United States of America Patent

PATENT NO 9397025
SERIAL NO

13725637

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Abstract

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The present invention provides a semiconductor device including: a semiconductor chip; a lead frame provided with a recessed portion on at least one of an upper surface or a lower surface thereof, and electrically coupled to the semiconductor chip; and a resin section that molds the semiconductor chip and the lead frame, and is provided with an opening above the recessed portion. By inserting a conductive pin (not shown) into the recessed portion through the opening, a plurality of semiconductor devices can be mechanically and electrically coupled to each other.

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Patent Owner(s)

  • MONTEREY RESEARCH, LLC

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kasai, Junichi Kanagawa, JP 110 3447
Meghro, Kouichi Kanagawa, JP 2 19

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