STACKED-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE HAVING A PLURALITY OF NEGATIVE LEAD PINS AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Mar 20, 2014
app pub date -
Sep 14, 2012
filing date -
Sep 14, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a plurality of stacked-type capacitors stacked on top of one another and electrically connected with each other, and each stacked-type capacitor has a positive portion and a negative portion. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal. The first conductive terminal has a first embedded portion electrically connected to the positive portion and enclosed by the package body and a first lateral exposed portion connected to the first embedded portion. The second conductive terminal has a second lateral exposed portion, a second front exposed portion, a second rear exposed portion, and a second embedded portion electrically connected to the negative portion and enclosed by the package body.
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