PACKAGE, METHOD FOR MANUFACTURING A PACKAGE, AND USE OF SUCH PACKAGE
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United States of America Patent
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N/A
Issued Date -
Mar 20, 2014
app pub date -
Apr 17, 2012
filing date -
Apr 29, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A package including at least a first and a second side wall bonded to each other along at least one seam line forming a bond. The bond is peelable along at least a portion of the seam line. A first grip portion is formed on the first side wall, formed by a first folded-over portion of the first side wall folded along a first fold line and a second fold line. The first folded-over portion includes three layers of the first side wall, and all layers in the first folded-over portion are included in the bond.
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