OVERMOULDING METHOD AND OVERMOULDED ELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
Mar 20, 2014
app pub date -
Apr 20, 2012
filing date -
Apr 21, 2011
priority date (Note) -
Abandoned
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Abstract
An overmoulded electronic assembly wherein a moulded thermoplastic cover encapsulates and is in direct contact with the electronic components, printed circuit board and an antenna is disclosed. There also a disclosed a method of fabricating an overmoulded electronic assembly using an injection moulding machine and where the thermoplastic cover encapsulates and is in direct contact with the electronic components, printed circuit board and an antenna.
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