Fabrication method of carrier-free semiconductor package
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United States of America Patent
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Feb 24, 2015
Grant Date -
Mar 20, 2014
app pub date -
Nov 21, 2013
filing date -
Mar 10, 2011
priority date (Note) -
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Abstract
A carrier-free semiconductor package includes a circuit structure having an insulating layer and a circuit layer embedded in the insulating layer and having a plurality of conductive traces and RF (radio frequency) traces, a chip disposed on a first surface of the insulating layer and electrically connected to the conductive traces, an encapsulant covering the chip and the circuit layer, a ground layer formed on a second surface of the insulating layer opposite to the first surface, and a plurality of solder balls disposed on the conductive traces or terminals on the conductive traces, wherein portions of the solder balls electrically connect the ground layer so as to allow the RF traces and the ground layer to form a microstrip line having an RF function, thus obtaining a single-layer carrier-free semiconductor package having low cost and simplified RF design.
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