Method of manufacturing a wiring substrate
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United States of America Patent
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-
Sep 6, 2016
Grant Date -
Mar 27, 2014
app pub date -
Dec 3, 2013
filing date -
May 7, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of manufacturing a wiring substrate including a step of forming a through hole that includes forming a first concave portion in a substrate that extends from a second surface to a first insulating layer without passing through the first insulating layer; forming a second insulating layer at least within the first concave portion; and forming a second concave portion through the second insulating layer and the first insulating layer to expose a surface of a pad electrode, wherein the second concave portion is formed within the first concave portion; and filling the first concave portion and the second concave portion with a conductive body or forming the conductive body to coat inner walls of the first concave portion and the second concave portion, and forming the through electrode such that it is connected to the pad electrode.
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