METHOD FOR REMOVING FOREIGN PARTICLES ADHERED TO MOLDS

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United States of America Patent

SERIAL NO

14034789

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Positions on a mold at which foreign matter is present are detected, and adhered position information related to the positions is obtained. Corresponding position information related to positions on a substrate, which are positions that correspond to the positions of the foreign matter when a pattern of protrusions and recesses and a surface of the substrate on which a curable composition is coated face each other and undergo a predetermined positioning operation, is generated based on the adhered position information. At least one droplet of the curable composition is arranged at the positions of the substrate. The pattern of protrusions and recesses is pressed against the surface of the substrate on which the composition is coated while administering the predetermined positioning operation. The curable composition is cured, and the mold is separated from the cured composition. Thereby, foreign matter adhered to molds can be removed efficiently and at low cost.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM CORPORATIONTOKYO 106-8620

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
OMATSU, Tadashi Haibara-gun, JP 60 365
WAKAMATSU, Satoshi Haibara-gun, JP 42 268

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