Manufacturing method for printed circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 26, 2015
Grant Date -
Mar 27, 2014
app pub date -
Sep 11, 2013
filing date -
Sep 27, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printed circuit board is manufactured by forming on a top surface of a support base, in a pattern having a predetermined width, a first metal layer for defining boundary ends between adjacent printed circuit boards in a printed circuit board assembly, forming on top of the first metal layer a wiring structure portion having an insulating layer and a conductive layer for each printed circuit board in the printed circuit board assembly, forming, in the wiring structure portion, grooves having a pattern corresponding to the pattern of the first metal layer to expose the first metal layer, forming a second metal layer on the wall surface of the grooves in the wiring structure portion, and cutting the first metal layer on the bottom surface of the grooves to separate each printed circuit board.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully