Heterogeneous integration of microfluidic devices in package structures

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United States of America Patent

PATENT NO 9674945
APP PUB NO 20140083858A1
SERIAL NO

13624288

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Abstract

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Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a microfluidic die to a package structure, wherein the microfluidic die comprises a plurality of asymmetric electrodes that may be coupled with signal pads disposed within the package structure.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eid, Feras Chandler, US 266 923
Lin, Kevin Beaverton, US 161 1789
Ma, Qing Saratoga, US 240 7074
Teh, Weng Hong Phoenix, US 48 659

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