Nitride semiconductor wafer, nitride semiconductor device, and method for manufacturing nitride semiconductor wafer

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United States of America Patent

PATENT NO 9397167
APP PUB NO 20140084296A1
SERIAL NO

13729713

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Abstract

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A nitride semiconductor wafer includes a silicon substrate, a stacked multilayer unit, a silicon-containing unit, and an upper layer unit. The silicon substrate has a major surface. The stacked multilayer unit is provided on the major surface. The stacked multilayer unit includes N number of buffer layers. The buffer layers include an i-th buffer layer, and an (i+1)-th buffer layer provided on the i-th buffer layer. The i-th buffer layer has an i-th lattice length Wi in a first direction parallel to the major surface. The (i+1)-th buffer layer has an (i+1)-th lattice length W(i+1) in the first direction. A relation that (W(i+1)−Wi)/Wi≦0.008 is satisfied for all the buffer layers. The silicon-containing unit is provided on the stacked multilayer unit. The upper layer unit is provided on the silicon-containing unit.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOSHIBAMINATO-KU TOKYO 105-0023

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Harada, Yoshiyuki Tokyo, JP 84 485
Hikosaka, Toshiki Kanagawa-ken, JP 109 350
Nunoue, Shinya Chiba-ken, JP 312 3280
Sugiyama, Naoharu Kanagawa-ken, JP 86 2173
Yoshida, Hisashi Kanagawa-ken, JP 108 970

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