Encapsulated metal interconnect

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United States of America Patent

PATENT NO 9018092
APP PUB NO 20140084465A1
SERIAL NO

13629402

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Abstract

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A plurality of metal tracks are formed in an integrated circuit die in three metal layers stacked within the die. A protective dielectric layer is formed around metal tracks of an intermediate metal layer. The protective dielectric layer acts as a hard mask to define contact vias between metal tracks in the metal layers above and below the intermediate metal layer.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION;STMICROELECTRONICS, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Clevenger, Lawrence A LaGrangeville, US 711 4447
Radens, Carl LaGrangeville, US 157 2296
Xu, Yiheng Hopewell Junction, US 53 340
Zhang, John H Fishkill, US 176 1359

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