Electronic circuit and method of fabricating the same
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United States of America Patent
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Oct 31, 2017
Grant Date -
Mar 27, 2014
app pub date -
Feb 20, 2013
filing date -
Sep 24, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is an electronic circuit including a substrate having a flat device region and a curved interconnection region. A conduction line may extend along an uneven portion in the interconnection region and may be curved. The uneven portion and the conductive line may have a wavy shape. An external force applied to the electronic circuit may be absorbed by the uneven portion and the conductive line. The electronic device may not be affected by the external force. Therefore, functions of the electronic circuit may be maintained. A method of fabricating an electronic circuit according to the present invention may easily adjust areas and positions of the interconnection region and the device region.
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