Circuit board incorporating semiconductor IC and manufacturing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9635756
SERIAL NO

14032093

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Disclosed herein is a manufacturing method of a circuit board. The manufacturing method includes a first step for preparing a prepreg in which a core material is impregnated with an uncured resin. The prepreg has a through-hole surrounded by the core material and the resin so as to penetrate through the core material and the resin. The manufacturing method further includes a second step for housing a semiconductor IC in the through-hole, and a third step for pressing the prepreg so that a part of the resin flows into the through-hole to allow the semiconductor IC housed in the through-hole to be embedded in the resin.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • TDK CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mochizuki, Tsuyoshi Tokyo, JP 22 158
Ohkawa, Hiroshige Tokyo, JP 9 112
Suzuki, Yoshihiro Tokyo, JP 119 1260
Tsuyutani, Kazutoshi Tokyo, JP 12 52

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Oct 25, 2024
11.5 Year Payment $7400.00 $3700.00 $1850.00 Oct 25, 2028
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00