METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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United States of America Patent
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app pub date -
Nov 22, 2013
filing date -
Apr 2, 2010
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Abstract
A method of manufacturing a semiconductor device includes: supplying a supercritical fluid mixed with an under-fill material to a stacked unit, which has a plurality of stacked semiconductor chips; and filling the under-fill material in the space between the plurality of the semiconductor chips, by heating the stacked unit placed in the inside of the high-pressure vessel and curing the under-fill material flowing in the space between the plurality of the semiconductor chips by a polymerization reaction, while the supercritical fluid is being supplied.
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