Method of forming a conductive polymer microstructure

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United States of America Patent

PATENT NO 9099529
APP PUB NO 20140087552A1
SERIAL NO

14032067

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Abstract

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The present disclosure relates to microstructure devices, in which a conductive pattern is formed on the basis of a conductive polymer material. In order to avoid the deposition and processing of the sacrificial materials and reduce a negative influence of the lithography process on sensitive conductive polymer materials a one-layer patterning sequence is proposed, in which a trench pattern is formed in a dielectric material that is subsequently filled with the conductive polymer material.

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Patent Owner(s)

  • STMICROELECTRONICS S.R.L.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Di, Matteo Andrea Naples, IT 15 372
Di, Palma Vincenza Cimitile, IT 11 35
Occhipinti, Luigi Giuseppe Ragusa, IT 11 64

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