LIQUID-COOLED HEAT DISSIPATING DEVICE AND METHOD OF MAKING THE SAME

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United States of America Patent

SERIAL NO

14077430

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Abstract

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A liquid-cooled heat dissipating device includes a chamber-confining body confining a liquid chamber adapted to receive a liquid coolant, and having a surrounding wall that surrounds the liquid chamber, a cover plate covering the liquid chamber and sinter-bonded to the surrounding wall, a liquid inlet spatially communicating with the liquid chamber, and a liquid outlet spatially communicating with the liquid chamber. A method of making the liquid-cooled heat dissipating device is also disclosed.

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Patent Owner(s)

Patent OwnerAddress
TONG HSING ELECTRONIC INDUSTRIES LTDNO 88 LN 1125 HEPING RD BADE DIST TAOYUAN CITY 334

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHIANG, Wen-Chung Lujhu Township, TW 13 73

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