Material for a molded resin for use in a semiconductor light-emitting device

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United States of America Patent

PATENT NO 9105822
APP PUB NO 20140091266A1
SERIAL NO

14100096

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Abstract

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The present invention provides a material for a molded resin as a material for a semiconductor light-emitting device that can yield a highly durable (light resistance and heat resistance) molded resin and can also improve the LED output through an excellent reflectivity. The present invention also provides an easily moldable material for a molded resin for a semiconductor light-emitting device. The material for a molded resin for a semiconductor light-emitting device is a resin composition, comprising (A) a polyorganosiloxane, (B) a white pigment, and (C) a curing catalyst, wherein the white pigment (B) has the following characteristics (a) and (b):

    (a) an aspect ratio 1.2 or more and 4.0 or less, and(b) a primary particle diameter 0.1 μm or more and 2.0 μm or less.

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Patent Owner(s)

  • MITSUBISHI CHEMICAL CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mori, Yutaka Kitakyushu, JP 96 1347
Otsu, Takeshi Yokohama, JP 17 44
Takasu, Mayuko Kitakyushu, JP 3 15
Takizawa, Kenichi Kitakyushu, JP 42 174

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