LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE ASSEMBLY, AND ELECTRODE-BEARING SUBSTRATE

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United States of America Patent

APP PUB NO 20140091337A1
SERIAL NO

14096570

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Abstract

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A light-emitting device assembly includes a substrate, an optical semiconductor element mounted on the surface of the substrate, an encapsulating layer formed on the substrate surface to encapsulate the optical semiconductor element, and an electrode formed on the substrate surface to be electrically connected to the optical semiconductor element. On the substrate, only an encapsulating region and an electrode region are formed, the encapsulating region including the optical semiconductor element and being defined by the encapsulating layer, and the electrode region being defined by the electrode exposed from the encapsulating layer.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATIONOSAKA 567-8680

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KITAYAMA, Yoshihiko Osaka, JP 4 72
MITANI, Munehisa Osaka, JP 16 103
OOYABU, Yasunari Osaka, JP 81 695

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