Encapsulating sheet-covered semiconductor element and semiconductor device
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United States of America Patent
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May 5, 2015
Grant Date -
Apr 3, 2014
app pub date -
Oct 1, 2013
filing date -
Oct 3, 2012
priority date (Note) -
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Abstract
An encapsulating sheet-covered semiconductor element includes a semiconductor element having one surface in contact with a board and the other surface disposed at the other side of the one surface and an encapsulating sheet covering at least the other surface of the semiconductor element. The encapsulating sheet includes an exposed surface that is, when projected from one side toward the other side, not included in the one surface of the semiconductor element and exposed from the one surface and the exposed surface has the other side portion that is positioned toward the other side with respect to the one surface of the semiconductor element.
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