High density second level interconnection for bumpless build up layer (BBUL) packaging technology

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9721878
SERIAL NO

13631392

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Abstract

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An apparatus including a die including a device side; and a build-up carrier including a body including a plurality of alternating layers of conductive material and dielectric material disposed on the device side of the die, an ultimate conductive layer patterned into a plurality of pads or lands; and a grid array including a plurality of conductive posts disposed on respective ones of the plurality of pads of the ultimate conductive layer of the body, at least one of the posts coupled to at least one of the contact points of the die through at least a portion of the conductive material of the body. A method including forming a body of a build-up carrier including a die, the body of the build-up carrier including an ultimate conductive layer and forming a grid array including a plurality of conductive posts on the ultimate conductive layer of the body.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheah, Bok Eng Bayan Lepas, MY 180 927
Ooi, Kooi Chi Bayan Lepas, MY 83 882
Periaman, Shanggar Penang, MY 24 795

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