Chip-size, double side connection package and method for manufacturing the same
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United States of America Patent
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May 29, 2018
Issued Date -
N/A
app pub date -
Oct 14, 2013
filing date -
May 9, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A low resistance metal is charged into holes formed in a semiconductor substrate to thereby form through electrodes. Post electrodes of a wiring-added post electrode component connected together by a support portion thereof are simultaneously fixed to and electrically connected to connection regions formed on an LSI chip. On the front face side, after resin sealing, the support portion is separated so as to expose front face wiring traces. On the back face side, the semiconductor substrate is grounded so as to expose tip ends of the through electrodes. The front face wiring traces exposed to the front face side and the tip ends of the through electrodes exposed to the back face side are used as wiring for external connection.
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