CASE UTILIZING REINFORCED FILM FOR IN-MOLD LABELING
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United States of America Patent
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N/A
Issued Date -
Apr 3, 2014
app pub date -
Sep 25, 2013
filing date -
Sep 25, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Described is a case for enclosing a personal electronic device including a first layer co-molded with a second layer and permanently affixed together to form a one-piece assembly; and a reinforcing member. The first layer includes a bottom surface, side surfaces joined to the bottom surface and extending upward therefrom, and a fitted cavity configured to accept and retain the personal electronic device such that the bottom surface covers at least a portion of a bottom surface of the inserted personal electronic device and the side surfaces cover at least a portion of a side surface of the inserted personal electronic device. The second layer includes a bottom surface and side surfaces sized and shaped to cover an exterior of the bottom and side surfaces of the first layer. The reinforcing member is configured to strengthen areas of the second layer.
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