Embedded structures for package-on-package architecture

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United States of America Patent

PATENT NO 8866287
SERIAL NO

13631990

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Abstract

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Electronic assemblies including substrates and their manufacture are described. One assembly includes a die embedded in a dielectric layer in a multilayer substrate, and a dielectric region embedded in the dielectric layer in the multilayer substrate. The multilayer substrate includes a die side and a land side, with the first dielectric region and the dielectric layer extending to the die side. A plurality of vias are positioned within the first dielectric region, the vias extending to pads on the die side. Other embodiments are described and claimed.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Raghunathan, Vinodhkumar Chandler, US 6 57
Teh, Weng Hong Phoenix, US 48 662

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