UV TREATMENT OF POLISHED WAFERS
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United States of America Patent
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Issued Date -
Apr 10, 2014
app pub date -
Oct 3, 2013
filing date -
Oct 4, 2012
priority date (Note) -
Abandoned
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Abstract
A method is provided for cleaning a surface of a semiconductor wafer comprising: (a) contacting the front surface of the wafer with a slurry comprising an abrasive agent and a polymeric rheological modifier; (b) contacting the front surface of the semiconductor wafer with an oxidant; and (c) irradiating the front surface of the semiconductor wafer with ultraviolet light.
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