Self-assembled pattern forming method

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United States of America Patent

PATENT NO 8974682
APP PUB NO 20140097152A1
SERIAL NO

13930262

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Abstract

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A self-assembled pattern forming method in an embodiment includes: forming a guide pattern on a substrate; forming a layer of a first polymer; filling a first block copolymer; and phase-separating the first block copolymer. The guide pattern includes a first recessed part having a depth T and a diameter D smaller than the depth T, and a second recessed part having a width larger than double of the diameter D. The first block copolymer has the first polymer and a second polymer which are substantially the same in volume fraction. By phase-separating the first block copolymer, a cylinder structure and a lamellar structure are obtained.

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Patent Owner(s)

  • KABUSHIKI KAISHA TOSHIBA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hieda, Hiroyuki Yokohama, JP 41 672
Kamata, Yoshiyuki Tokyo, JP 137 1318
Kihara, Naoko Kawasaki, JP 55 616
Kikitsu, Akira Yokohama, JP 155 1736
Yamamoto, Ryosuke Kawasaki, JP 78 206

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