FLIP PACKAGING DEVICE
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United States of America Patent
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Issued Date -
Apr 10, 2014
app pub date -
Aug 26, 2013
filing date -
Oct 10, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed is a flip chip packaging device and structure of interconnections between a chip and a substrate. In one embodiment, a flip chip packaging device can include: (i) a chip and a substrate; (ii) a plurality of first connecting structures and a plurality of second connecting structures that are aligned and configured to electrically connect the chip and the substrate; and (iii) where each of the plurality of first connecting structures comprises a first metal, and each of the plurality of second connecting structures comprises a second metal, and where a hardness of the first metal is less than a hardness of the second metal.
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