Integrated circuit package with multiple dies and a multiplexed communications interface

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United States of America Patent

PATENT NO 9105316
APP PUB NO 20140098617A1
SERIAL NO

14101444

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Abstract

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A package includes a first die and a second die. An interface connects the first die and the second die. At least one of the first and second dies includes a memory. The interface is configured to transport both control signals and memory transactions. A multiplexing circuit multiplexes the control signals and the memory transactions onto the interface such that connections of the interface are shared by the control signals and the memory transactions.

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Patent Owner(s)

  • STMICROELECTRONICS PVT. LTD.;STMICROELECTRONICS S.R.L.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jones, Andrew Michael Bristol, GB 41 724
Ryan, Stuart Bristol, GB 30 353
Scandurra, Alberto Messina, IT 14 179

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