METHOD FOR CUTTING GLASS PLATE

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United States of America Patent

SERIAL NO

14107684

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for cutting a glass plate includes a first step of radiating a laser beam onto a front surface of the glass plate and forming a crack in the glass plate. The laser beam has a wavelength of 5000-11000 nm and becomes a linear beam at the front surface of the glass plate. The linear beam is formed into a shape conforming to a predetermined cut line, has a length greater than or equal to 10 mm along the predetermined cut line and a width less than or equal to 3 mm, and has an intensity distribution substantially uniform along the predetermined cut line. In the first step, a position of the linear beam in the front surface of the glass plate is fixed for a prescribed time, and at least one end part of the linear beam is located at an outer peripheral part of the glass plate.

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Patent Owner(s)

Patent OwnerAddress
ASAHI GLASS COMPANY LIMITEDCHIYODA-KU TOKYO 100-8405

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Echigo, Yusuke Tokyo, JP 1 50
Iwasaki, Tatsuya Tokyo, JP 158 33163
SAITO, Isao Tokyo, JP 101 1199

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