OPTOELECTRONIC COMPONENT AND METHOD FOR ITS MANUFACTURING
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United States of America Patent
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Issued Date -
Apr 17, 2014
app pub date -
Mar 7, 2011
filing date -
Mar 19, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An optoelectronic component, including a housing including a thermosetting plastic including at least one material selected from the group consisting of aminoplastic thermosetting plastic, urea thermosetting plastic, melamine-formaldehyde thermosetting plastic, wet polyester thermosetting plastics, bulk molding compounds, polyester resin, phenolic resin and vinyl ester resin, a recess in the housing, and a radiation-emitting component, arranged in the recess, wherein the optoelectronic component includes a gate mark.
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