Wafer-level RF transmission and radiation devices
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United States of America Patent
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Dec 9, 2014
Issued Date -
N/A
app pub date -
Oct 12, 2012
filing date -
Oct 12, 2012
priority date (Note) -
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Abstract
Method for constructing a dipole radio frequency antenna includes depositing on a dielectric substrate at least one layer each of a conductive material, a dielectric material, and a sacrificial material. The deposit of conductive material is controlled to form a transmission line, antenna radiating element and associated antenna feed. The transmission line includes a shield formed of one or more walls and a center conductor disposed coaxially within the shield. An antenna feed portion is electrically connected to the center conductor and extends through a feed port on the transmission line to connect with an antenna radiating element. The radiating element has an elongated form which extends a first predetermined length transverse to an axis of the transmission line. The method also includes dissolving at least one layer of the sacrificial material to form a clearance space between the surface of the dielectric substrate and the antenna radiating element.
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