THROUGH SUBSTRATE VIA INDUCTORS

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20140104284A1
SERIAL NO

13653132

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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This disclosure provides systems, methods, and apparatus for through substrate via inductors. In one aspect, a cavity is defined in a glass substrate. At least two metal bars are in the cavity. A first end of each metal bar is proximate a first surface of the substrate, and a second end of each metal bar is proximate a second surface of the substrate. A metal trace connects a first metal bar and a second metal bar. In some instances, one or more dielectric layers can be disposed on surfaces of the substrate. In some instances, the metal bars and the metal trace define an inductor. The inductor can have a degree of flexibility corresponding to a variable inductance. Metal turns can be arranged in a solenoidal or toroidal configuration. The toroidal inductor can have tapered traces and/or thermal ground planes. Transformers and resonator circuitry can be realized.

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Patent Owner(s)

Patent OwnerAddress
SNAPTRACK INC4040 MOORPARK AVENUE SUITE 250 SAN JOSE CA 95117

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gousev, Evgeni Petrovich San Jose, US 35 1217
Kidwell, Donald William Los Gatos, US 11 209
Kim, Jitae Mountain View, US 28 296
Lai, Kwan-yu San Jose, US 29 701
Lasiter, Jon Bradley Stockton, US 26 732
Shenoy, Ravindra V Dublin, US 53 1395
Stephanou, Philip Jason Mountain View, US 39 1003

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