Rigid circuit board with flexibly attached module

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United States of America Patent

SERIAL NO

13573976

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Abstract

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An electrical interconnection system comprises a bifurcated, multilayer flex circuit having electrode pads on the inner surfaces of the bifurcation. Electronic components are mounted on one or both sides of the flex circuit by conventional means. When the bifurcation is spread apart, the electrode pads are alignable with respective contacts on a printed circuit board. After bonding the pads to the contacts by soldering, conductive adhesive, or other means, a secure electrical connection is maintained while still allowing the flex circuit to bend somewhat from side to side, creating additional design options not available with rigidly mounted components and modules.

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Patent Owner(s)

Patent OwnerAddress
MICROELECTRONICS ASSEMBLY TECHNOLOGIES INC104 T W ALEXANDRIA DRIVE RESEARCH TRIANGLE PARK NC 27709

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Clayton, James E Raleigh, US 83 2813
Fathi, Zakaryae Raleigh, US 123 1909

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