Printed circuit board with reduced emission of electro-magnetic radiation
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United States of America Patent
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Dec 29, 2015
Grant Date -
Apr 17, 2014
app pub date -
Oct 10, 2013
filing date -
Jul 13, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board including a first outer layer, a second outer layer and an integrated circuit mounted on the second outer layer. The integrated circuit has a single exposed pad electrically connected to a ground reference, a first supply pin electrically connected to a first power supply and a second supply pin electrically connected to a second power supply, wherein the first power supply is configured to generate a first supply current with frequency components higher than the frequency components of a second supply current generated by the second power supply.
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