Circuit board incorporating electronic component and manufacturing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10917974
APP PUB NO 20140104803A1
SERIAL NO

14054556

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Disclosed herein is a circuit board that includes a resin substrate including a substrate wiring layer, and an electronic component embedded in the resin substrate and having a plurality of external electrodes. The resin substrate includes a plurality of via holes that expose the external electrodes and a plurality of via conductors embedded in the via holes to electrically connect the substrate wiring layer to the external electrodes. At least some of the via holes are different in planar shape from each other.

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Patent Owner(s)

  • 501 TDK CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tsuyutani, Kazutoshi Tokyo, JP 12 52

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