DICING FILM WITH PROTECTING FILM
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United States of America Patent
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app pub date -
Dec 19, 2013
filing date -
Mar 11, 2011
priority date (Note) -
Abandoned
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Abstract
The present invention provides a dicing film with a protecting film that enables to paste a dicing film to a semiconductor wafer without a shift in position while reducing a downtime. There is provided a dicing film with a protecting film in which a dicing film and a protecting film are laminated, wherein the difference between the transmittance of the protecting film and the transmittance of the dicing film with a protecting film at a portion of the dicing film where light for detecting a film transmits first is 20% or more in a wavelength of 600 to 700 nm.
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