OPTICAL-SEMICONDUCTOR ENCAPSULATING MATERIAL
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United States of America Patent
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app pub date -
Dec 26, 2013
filing date -
Oct 7, 2009
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a sheet-shaped, optical-semiconductor encapsulating material including: a first resin layer containing inorganic particles; and a second resin layer containing a phosphor and being superposed directly or indirectly on the first resin layer, and relates to a kit for optical-semiconductor encapsulation including: a sheet-shaped molded body including a first resin layer containing inorganic particles; and a sheet-shaped molded body including a second resin layer containing a phosphor.
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