DEPOSITION APPARATUS
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United States of America Patent
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Issued Date -
Apr 24, 2014
app pub date -
Oct 18, 2013
filing date -
Oct 23, 2012
priority date (Note) -
Abandoned
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Abstract
In a deposition apparatus, as a plurality of plasma connection terminals that transfer plasma power to a plasma electrode are coupled in parallel to the plasma electrode, resistance caused by the plurality of plasma connection terminals is reduced and a current is distributed such that heat generated in the plurality of plasma connection terminals can be distributed. Therefore, even if high RF power is used, by preventing the plurality of plasma connection terminals from being oxidized, plasma is stably supplied and thus, stability of a deposition apparatus and the accuracy of a process can be enhanced.
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