Systems for Surface Treatment of Semiconductor Substrates using Sequential Chemical Applications

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United States of America Patent

APP PUB NO 20140116476A1
SERIAL NO

14145901

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Abstract

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Systems for removing post etch polymer residue from etched surface includes a first proximity head to introduce a first cleaning chemistry as a first meniscus to a portion of the surface of the substrate so as to cover a length that extends to at least a diameter of the substrate and a first width that is less than the diameter of the substrate. A second proximity head is configured to introduce a second cleaning chemistry as a second meniscus to the portion so as to cover the length that extends to the diameter and a second width that is less than the diameter of the substrate. A substrate supporting device equipped with a motor coupled to a computing system is used to move the substrate supporting device under the first proximity head at a first linear speed and under the second proximity head at a second linear speed.

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Patent Owner(s)

Patent OwnerAddress
LAM RESEARCH CORPORATIONFREMONT CA 94538

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mikhaylichenko, Katrina San Jose, US 50 441
Podlesnik, Dragan Palo Alto, US 27 983
Sabba, Yizhak Castro Valley, US 7 8

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