HEAT DISSIPATION MODULE
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United States of America Patent
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Issued Date -
May 1, 2014
app pub date -
Mar 13, 2013
filing date -
Oct 31, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A heat dissipation module includes multiple heat sink fins. The heat sink fins are assembled to one another along an assembly axis, and each of the heat sink fins includes a main body and an extension plate. The extension plate extends from one side of the main body towards an opposite side of the main body. An acute angle is formed between the extension plate and the main body. Each of the extension plates is located between the main bodies of the two heat sink fins adjacent to each other.
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