Lead frame with grooved lead finger

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9006874
APP PUB NO 20140120664A1
SERIAL NO

14147599

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Importance

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Abstract

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A lead finger of a lead frame has a number of channels or grooves in a portion of its top surface that provide a locking mechanism for securing a bond wire to the lead finger. The bond wire may be attached to the lead finger by stitch bonding.

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Patent Owner(s)

  • NXP USA, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Kok Leong Subang, MY 3 78
Chan, Wei Kee Kuala Lumpur, MY 4 19
Wong, Wai Keong Shah Alam, MY 12 47

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