APPARATUS AND METHOD FOR CUTTING WITH A LASER ARRAY
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United States of America Patent
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Nov 5, 2013
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Nov 5, 2012
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Abstract
An apparatus and a method are provided for cutting, cutting-out and perforating web or sheet substrates. The apparatus has a laser cutting device disposed above or below a transport plane for processing a substrate. The laser cutting device includes at least one laser array extending over the width of the substrate and having individually drivable lasers. The laser array is composed, in particular, of a plurality of individual arrays. The lasers are, in particular, constructed as vertical-cavity surface-emitting lasers. In this way, processing of the substrate at high transport speeds is made possible.
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